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Qualcomm Snapdragon 888 vs MediaTek Dimensity 1000+ Specification

Qualcomm Snapdragon 888 vs Dimensity 1000 Plus Specification Comparison | Mediatek Dimensity 1000 Plus vs Snapdragon 888

Qualcomm Snapdragon 888 vs Dimensity 1000 Plus specification comparison between two Premium flagship Mobile Processor. These two have the best feature of the company. there is some technological difference when you compare Mediatek Dimensity 1000 Plus vs Snapdragon 888 especially their manufacturing processor, CPU configuration, GPU, NPU, and 5G Modem. we have to check if these specs change really makes a performance difference for that we will be going to run some benchmark test of these processors. Here’s the comparison between Qualcomm Sd 888 vs Dimensity 1000 Plus based on their specs sheet, Benchmark. We will also find out their ranking in the Best mobile processor list 2021 and check which one tops this list. 

Qualcomm Snapdragon 888 vs Dimensity 1000 Plus Specification Comparison

Qualcomm Snapdragon 888 vs Dimensity 1000 Plus Specification has an octa-core CPU. Snapdragon 888 is using New ARM x1 Prime core that makes it a performance beast. The CPU of Dimensity 1000 Plus is Octa-Core, 64-bit, Arm Cortex-A77 @ up to 2.6GHz, Arm Cortex-A55 @ up to 2.0GHz where sd 888 has more powerful 1x 2.84 GHz – Cortex-X1, 3x 2.42 GHz – Cortex-A78, 4x 1.8 GHz – Cortex-A55 CPU. Mediatek Dimensity 1000 Plus vs Snapdragon 888 GPU is Arm Mali-G77 MC9 and Adreno 660.

Snapdragon 888 is made by a new 5nm manufacturing process while Dimensity is based on a 7nm process. Qualcomm also has a better Snapdragon X60 5G modem that supports global bandwidth, higher internet speed compare to MediaTek.

Mediatek Dimensity 1000 Plus vs Snapdragon 888 Antutu Benchmark

Mediatek Dimensity 1000 Plus vs Snapdragon 888 Antutu Benchmark score is 511363 and 847868. This is a big performance difference between these processors.

Mediatek Dimensity 1000 Plus vs Sd 888 Geekbench Score

Mediatek Dimensity 1000 Plus Geekbench score is for (Single-Core) – 781 and Geekbench 5 (Multi-Core) – 3070 and Sd 888 able to score on Single-Core is 1226 and 3739 in Multi-Core.

BenchmarkSnapdragon 888Snapdragon 865
Antutu Score 847868511363
Geekbench Single Core 1226781
Geekbench Multi Core37393070

Qualcomm Snapdragon 888 vs Dimensity 1000 Plus Key Differences

Snapdragon 888Dimensity 1000 Plus
Smaller 5nm size compare 7nm
Better GPU and CPU
Better Benchmark score on Geekbench and Antutu

Sd 888 vs Dimensity 1000 FAQ

Dimensity 1000 Plus vs Sd 888 Which is the best for gaming?

Sd 888

Sd 888 vs Dimensity 1000 Which Is the best Processor?

Sd 888

Product Name

Qualcomm Snapdragon 888

MediaTek Dimensity 1000+ Specification

Product Image Qualcomm Snapdragon 888 MediaTek Dimensity 1000+ Specification
Price
Our Rating 7.0 6.5
Brand Qualcomm Mediatek
Category Processor Processor

Info

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Processor Manufacturer Qualcomm Mediatek
Announced 01 December, 2020 08 May, 2020
Model SM8350 MediaTek Dimensity 1000 Plus
Class Flagship Flagship

Processor Specification

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Production Process 5nm 7nm
CPU Configuration 1x 2.84GHz – Cortex-X1, 3x 2.42 GHz – Cortex-A78, 4x 1.8 GHz – Cortex-A55
Qualcomm® Kryo™ 680 CPU
Arm Cortex-X1 technology
25% higher performance
4x 2.6 GHz – Cortex-A77 and 4x 2 GHz – Cortex-A55
GPU Name Qualcomm® Adreno™ 660 GPU

GPU Video Playback: Volumetric VR video playback, 8K 360 VR video playback

API Support: OpenCL™ 2.0 FP, OpenGL® ES 3.2, Vulkan® 1.1, DX12
Arm Mali-G77 MC9
RAM Support LPDDR5 Upto 20GB 2150MHx LPDDR4x, 16GB
APU / NPU / AI Proc. / Neural IP Hexagon Processor: Qualcomm® Hexagon™ 780 Processor; 2nd gen Qualcomm® Sensing Hub, Large shared AI memory, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Qualcomm® Hexagon™ Tensor Accelerator Hexa-Core AI Processor, MediaTek newest AI Processing Unit - APU 3.0 - houses six AI processors (two big cores, three small cores and a single tiny core) to meet smartphone AI needs. APU 3.0 offers a huge 4.5 TOPS performance.
Display Support Max On-Device Display: 4K @ 60 Hz, QHD+ @ 144 Hz

Display Features: Demura and subpixel rendering for OLED uniformity

Max External Display: 4K @ 60 Hz

HDR: HDR10+, HLG, Dolby Vision, HDR10

Color Depth: Up to 10-bit

Color Gamut: Rec2020
Max Display Resolution: 2520 x 1080
Video Encoding: H.264, H.265 / HEVC
Video Playback: H.264, H.265 / HEVC, VP-9, AV1

Audio Playback Audio Technology: Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8835, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385, Qualcomm Aqstic™ audio technology
ISP Image Signal Processor: Qualcomm Spectra™ 580 image signal processor, Triple 14-bit CV-ISPs, Hardware accelerator for computer vision (CV-ISP)

Dual Camera, MFNR, ZSL, 30fps: Up to 64 MP

Triple Camera, MFNR,, 30fps, ZSL: Up to 28 MP

Single Camera, MFNR, ZSL, 30fps: Up to 84 MP

Single Camera: Up to 200 MP

Camera Features: Real-time object classification, Low light photography architecture, 10-bit HDR HEIF photo capture, Multi-frame Noise Reduction (MFNR)

HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD
Camera - 32+16MP, 80MP
Video capture Dolby Vision, HDR10, HDR10+, HEVC
720p @ 960 FPS
4k @ 60 FPS HDR
8k @ 30 FPS

Slow Motion Video Capture: 720p @ 960 FPS

Video Capture Formats: Dolby Vision, HDR10, HDR10+, HEVC

Video Capture Features: Rec. 2020 color gamut video capture, 4K HDR with Computational HD, 8K video capture at 30fps, Up to 10-bit color depth video capture
Codec Support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9

3840 x 2160
Cellular Technology Qualcomm® Snapdragon™ X60 5G modem-RF system
Cellular Technology: 5G NR, LTE including CBRS support, HSPA, WCDMA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
Peak Download Speed: 7.5 Gbps

Peak Upload Speed: 3 Gbps
5G Network 5G Spectrum: Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz

5G mmWave specs: 800 MHz bandwidth, 8 carriers, 2x2 MIMO

5G sub-6 GHz specs: 200 MHz bandwidth, 4x4 MIMO

Multi-SIM features: Global 5G multi-SIM
5G Downlink speed:  Up to 7.5 Gbps

2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
5G Modem
WiFi-6 ready
Wifi Modem Wi-Fi/Bluetooth Subsystem: Qualcomm® FastConnect™ 6900

Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, 802.11a/b/g, 802.11n

Qualcomm® Wi-Fi 6 technology features: MU-MIMO (Uplink and Downlink), 8x8 sounding, 160 MHz channel support, OFDMA (Uplink and Downlink), 4K QAM, WPA3 security support, 6 GHz operation (Wi-Fi 6E)

Wi-Fi Spectral Bands: 2.4GHz, 5GHz, 6GHz

Wi-Fi 6 features: MU-MIMO (Uplink and Downlink), 8x8 sounding, 6 GHz operation (Wi-Fi 6E), OFDMA (Uplink and Downlink), 4K QAM, Dual-band simultaneous (DBS), WPA3 security support, 4-Stream Dual-band simultaneous, Target Wake Time, 160 MHz channel support
Wi-Fi 6 (a/b/g/n/ac/ax)
Wi-Fi Antenna: 2T2R
Peak Download Speed: 4.7Gbps
Peak Upload Speed: 2.3Gbps
GPS GPS The Global Positioning System is a satellite-based radio navigation system, GPS permits users to determine their position, velocity and the time 24 hours a day, in all weather, anywhere in the world, In order to locate your position, your device or GPS receiver must have a clear view of the sky. Beidou, Galileo, GLONASS, Dual frequency GNSS, NavIC, NavIC enabled, GPS, GNSS, QZSS, SBAS
Bluetooth Bluetooth is a wireless communications technology for exchanging data between mobile phones, headsets, computers and other network devices over short distances without wires, Bluetooth technology was primarily designed to support simple wireless networking of personal consumer devices. Bluetooth Audio:  Qualcomm® aptX™ Adaptive Audio,  LE Audio Features, Qualcomm TrueWireless™ Technology, Bluetooth 5.2 5.1
USB USB 3.1, USB-C USB 3.0
Charging Speed Qualcomm® Quick Charge™ 5 technology is 70% more efficient and supports 0-100% charging in less than 15 minutes*
AnTuTu benchmark scores 747868 511363
Geekbench scores Single-Core Score 1226
Multi-Core Score 3739
Geekbench 5 (Single-Core) – 781 and Geekbench 5 (Multi-Core) – 3070

CPU

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Size 5nm 7nm
CPU Cores 8 8
CPU Configuration 1x 2.84 GHz – Kryo 680 Prime (Cortex-X1), 3x 2.42 GHz – Kryo 680 Gold (Cortex-A78), 4x 1.8 GHz – Kryo 680 Silver (Cortex-A55) 4x 2.6 GHz – Cortex-A77 and 4x 2 GHz – Cortex-A55
High Frequency 2840 MHz 2600 MHz
Core architecture hybrid (big.LITTLE) hybrid (big.LITTLE)
Performance Core 1x 2.84 GHz – Kryo 680 Prime (Cortex-X1) and 3x 2.42 GHz – Kryo 680 Gold (Cortex-A78) 4x 2.6 GHz – Cortex-A77
Power Efficient Core 4x 1.8 GHz – Kryo 680 Silver (Cortex-A55) 4x 2 GHz – Cortex-A55
L1 Cache 512 KB -
L2 cache 1.00 MB -
L3 cache 4 MB -
Storage Type UFS 3.0, UFS 3.1 UFS 2.2
Instruction set ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
Thermal Design Power (TDP) 10 W 10 W
Extra Feature Arm Cortex-X1 technology
5nm Size

GPU

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
GPU GPU (Graphics Processing Unit) is a single-chip processor designed to rapidly manipulate and alter memory to accelerate the creation of images in a frame buffer intended for output to a display, This includes things such as lighting effects, object transformations, and 3D motion. Qualcomm® Adreno™ 660 GPU

Mali-G77 MC9
GPU Memory 840 MHz
850 MHz
Architecture Adreno 600 Valhall
FLOPS -
OpenGL Version 2.0 2.0
DirectX Support DirectX Support 12 12
Vulkan version 1.1 1.1
Shading units 512 144
Video Encoding HDR Playback Codec support for HDR10+, HDR10, HLG and Dolby Vision H.264, H.265 / HEVC
Video Playback Volumetric VR video playback, 8K 360 VR video playback H.264, H.265 / HEVC, VP-9, AV1
Gaming Qualcomm® Snapdragon Elite Gaming™
Qualcomm® Game Quick Touch increases responsiveness by up to 20%
Variable Rate Shading (VRS) p
HDR gaming (10-bit color depth, Rec. 2020
color gamut)
9X Extreme Gaming Cores: Arm Mali-G77 GPU
Extra Feature Qualcomm® Adreno™ 660 GPU delivers 35% faster graphics rendering
• Hardware-accelerated H.265 and VP9 decoder
• Physically Based Rendering

NPU

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
APU / NPU / AI Proc. / Neural IP 6th generation Qualcomm AI Engine with Hexagon 780 Processor
2nd gen Qualcomm® Sensing Hub,
MediaTek APU 3.0
TOPS Speed 26 TOPS 4.5 TOPS performance,
Extra Feature Fused AI Accelerator
• Hexagon Tensor Accelerator
• Hexagon Vector eXtensions
• Hexagon Scalar Accelerator

Memory

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
RAM Type LP-DDR5 LPDDR4X
RAM frequency 3200 MHz 1866 MHz
RAM Max up to 16 GB 16 GB
Max Bandwidth 50 Gbit/s 29.87 Gbit/s
Bus Speed A bus is a subsystem that transfers data between computer components or between computers. 4x 16 Bit 4x 16 Bit

Connectivity

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Cellular Modem Snapdragon X60 5G Modem-RF System Mediatek 5G-integrated Modem
Cellular Technology Cellular Technology: 5G NR, LTE including CBRS support, HSPA, WCDMA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

2G / 3G / 4G / 5G Multi-Mode, 4G Carrier Aggregation (CA), 5G Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), EDGE, 4G FDD / TDD, 5G FDD / TDD, GSM, TD-SCDMA, WDCDMA
4G Network LTE Cat. 22
4G Carrier Aggregation (CA), 4G FDD / TDD
5G Modem
5G Network 5G mmWave and sub-6 GHz, standalone (SA)
and non-standalone (NSA) modes, FDD, TDD
SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 200 MHz bandwidth, 4x4 MIMO, 256QAM NR UL 2CC, 2x2 MIMO, 256QAM VoNR / EPS fallback
5G mmWave 800 MHz bandwidth, 8 carriers, 2x2 MIMO 2x2 MIMO,
5G sub-6 GHz 200 MHz bandwidth, 4x4 MIMO 4x4 MIMO
5G Spectrum Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz -
Download Speed 7.5 Gbps 4.7Gbps
Upload Speed 3 Gbps 2.5Gbps
Dual SIM Global 5G multi-SIM yes
Extra Feature Qualcomm® 5G PowerSave
• Qualcomm® Smart Transmit™ technology
• Qualcomm® Wideband Envelope Tracking
• Qualcomm(r) AI-Enhanced Signal Boost

Mobile Connectivity system

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
wireless System FastConnect 6900 System Mediatek Wireless Chip
WiFi-6 ready
Wi-fi Wi-Fi is a popular wireless networking technology using radio waves to provide high-speed network connections that allows devices to communicate without cords or cables, Wi-Fi is increasingly becoming the preferred mode of internet connectivity all over the world. Wi-Fi Standards: Wi-Fi 6E, Wi-Fi 6 (802.11ax), Wi-Fi 5 (802.11ac), 802.11a/b/g/n Wi-Fi 6 (a/b/g/n/ac/ax), Wi-Fi Antenna: 2T2R
Wi-Fi Band 2.4 GHz, 5 GHz, 6 GHz 2.4 GHz, 5 GHz
Wi-Fi Speed 3.6 Gbps -
Bluetooth Bluetooth is a wireless communications technology for exchanging data between mobile phones, headsets, computers and other network devices over short distances without wires, Bluetooth technology was primarily designed to support simple wireless networking of personal consumer devices. Bluetooth 5.2 ( Bluetooth features: LE Audio Features (one-tomany broadcast), Dual Bluetooth antennas) 5.1
Bluetooth Audio Qualcomm® aptX™ Voice audio for crystal-clear voice calls, aptX Adaptive audio for robust, low latency, high quality audio, Qualcomm TrueWireless™ Mirroring -
GPS GPS The Global Positioning System is a satellite-based radio navigation system, GPS permits users to determine their position, velocity and the time 24 hours a day, in all weather, anywhere in the world, In order to locate your position, your device or GPS receiver must have a clear view of the sky. Beidou, Galileo, GLONASS, Dual frequency GNSS, NavIC, NavIC enabled, GPS, GNSS, QZSS, SBAS GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC
USB USB 3.1, USB-C USB 3.1
NFC NFC (Near field communication) is a set of standards for smartphones and similar devices to establish peer-to-peer radio communications with each other by touching them together or bringing them into proximity, usually no more than a few inches.
Extra Feature Channel Utilization: 20/40/80/160 MHz
• 8-stream sounding (for 8x8 MU-MIMO)
• MIMO Configuration: 2x2 (2-stream)
• MU-MIMO (Uplink & Downlink)
• 4K QAM
• OFDMA (Uplink & Downlink)
• Dual-band simultaneous (2x2 + 2x2)
• Wi-Fi Security: WPA3-Enterprise, WPA3-
Enhanced Open, WPA3 Easy Connect,
WPA3-Personal

ISP

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
ISP Qualcomm Spectra 580 Image Signal Processor
Triple 14-bit ISPs
• Up to 2.7 Gigapixels per Second computer vision
ISP (CV-ISP)
MediaTek Imagiq
5-core HDR-ISP
Single Camera Up to 200 MP 80MP
Dual Camera Triple Camera, MFNR, ZSL, 30fps: Up to 28 MP, Dual Camera, MFNR, ZSL, 30fps: Up to 64 MP 32MP + 16MP
Video capture 4K Video Capture + 64 MP Photo
• 8K Video Capture @ 30 FPS
• Slow-mo video capture at 720p @ 960 FPS
• 4K Video Capture @ 120 FPS
• 4K HDR Video Capture with Portrait Mode (Bokeh)
3840 x 2160
Video Codec HDR10+, HDR10, HLG, Dolby Vision
H.264, H.265, AV1, VP9
Extra Feature Multi-frame Noise Reduction (MFNR)
• Real-time object classification, segmentation, and
replacement
• Locally compensated Multi-Frame
Noise Reduction
• Multi-Frame and Staggered HDR sensor support
• Low light photography architecture
• Video super-resolution
• AI-based auto-focus and auto-exposure
• Advanced HW-based face detection with
deep-learning filter
HDR-ISP (3+2) / Video HDR / Video NR / Video Bokeh / Video EIS / AI-Shutter / AI-AE / AI-AF / AI-AWB / AI-NR HDR / AI-HDR / AI-FD

Display and Audio Support

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Display Support On-Device Display Support:
• 4K @ 60 Hz
• QHD+ @ 144 Hz
2520 x 1080
Refresh Rate up to144 Hz 144Hz
Max External Display Maximum External Display Support: up to 4K @ 60 Hz -
Extra Feature 10-bit color depth, Rec. 2020 color gamut
• HDR10 and HDR10+
• Demura and subpixel rendering for OLED Uniformity
-
Audio Playback Audio Technology: Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8835, Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385, Qualcomm Aqstic™ audio technology AIFF, CAF, MP3, MP4, WAV

Security

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Security Features Fingerprint Sensor: Qualcomm® 3D Sonic, Qualcomm® 3D Sonic Max

Secure Processing Unit: Biometric Authentication (Fingerprint, Iris, Voice, Face)
Fingerprint Sensor and Face Unlock
Fingerprint Sensor Fingerprint Sensor: Qualcomm® 3D Sonic, Qualcomm® 3D Sonic Max Yes
Face Detection

Charging

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Charging Speed Qualcomm® Quick Charge™ 5 technology is 70% more efficient and supports 0-100% charging in less than 15 minutes* -

Key Features

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
Key Features 5nm Size
Arm Cortex-X1 Prime Core
Snapdragon X60 5G Modem-RF System
FastConnect 6900 System

Benchmarks

Qualcomm Snapdragon 888MediaTek Dimensity 1000+ Specification
AnTuTu benchmark scores 747868 511363
Geekbench scores Single-Core Score 1226
Multi-Core Score 3739
Geekbench 5 (Single-Core) – 781 and Geekbench 5 (Multi-Core) – 3070
3DMark 46901
PCMark 4402
Octane V2 21933
Mozilla Kraken 2639

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